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Israel Develops New Technologies: New Photonic Chips Are Expected To Achieve Speeds Up To 100 Times Faster
Jun 25, 2018

The physicist Julie Levy of the Hebrew University of Israel and his research team have been working hard to develop a brand new chip technology. After more than three years of unremitting efforts, the research work has finally come to fruition.

They developed a new type of integrated photonic circuit fabrication technology using MONOS (Mono-Oxide-Nitride-Oxide-Silicon) structure. According to this, flash memory technology can be used on microchips, which is expected to make them smaller,and the faster photonic chip becomes a reality, and its operating frequency can even reach the terahertz level, which will increase the operating speed of computers and related optical communication equipment by 100 times.PE pellets

In recent years, terahertz technology has become a cross-cutting frontier for science and technology and has potential in the field of microchips. In general, optical communications encompasses all technologies that use light as an information carrier and transmit it over fiber optic cable. For example, the Internet, e-mail, SMS, telephony, cloud, and data centers all belong to the category of optical communications. Optical communications are extremely fast. However, in microchips, optical communications have become unreliable and difficult to repeat and expand. Specifically, there are two major technical problems that hinder the development and manufacturing of terahertz microchips. One is that the chip itself is overheated, and the other is non-scalability. Scientists pointed out that ultra-high-precision and repeatable fabrication of miniature photonic devices is an important technical guarantee for the successful development of integrated photonic chips.PVC pellets

Levy’s scientific research team cleverly bypassed the technical problems of low micro-nano processing precision, poor repeatability and poor expandability of photonic devices, and introduced flash memory technology into the processing of silicon-based photonic devices, successfully realizing reliable and reproducible photons. Device preparation. This move has important forward-looking and pioneering features for the future introduction of integrated photonic chips, which is expected to trigger a revolution in the chip industry.filling compound


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